000 00419nab a2200121Ia 4500
008 230808s2002 |||||||f |||| 00| 0 eng d
100 _aLee, J H
_9677124
245 0 _aDual Damascene Advanced Interconects; New Copper Seed Layer Enhamcement Process Metrology Using Ion Chromatography
300 _a945-953 p.
650 _aCopper Conductor
_9813394
773 _d2002
_tMicroelectronics Journal
_x00262692
942 _cART
_o51
_pABUL KALAM Library
999 _c772532
_d772532