| 000 | 00484nab a2200145Ia 4500 | ||
|---|---|---|---|
| 008 | 230808s2002 |||||||f |||| 00| 0 eng d | ||
| 100 |
_aZhang, Zhuquing _9766315 |
||
| 245 | 0 | _aAssembly of Lead-Free Bumped Flip-Chip with No-Flow Underfills | |
| 300 | _a113-119 p. | ||
| 650 |
_aFlip Chi P _9773702 |
||
| 650 |
_aLead-Free Solder _9756437 |
||
| 650 |
_aMaterial Properties _9172216 |
||
| 773 |
_d2002 _tIeee Transactions onElectronics Packaging Manufacturing _x1523334X |
||
| 942 |
_cART _o51 _pABUL KALAM Library |
||
| 999 |
_c770594 _d770594 |
||