000 00523nab a2200157Ia 4500
008 230808s2003 |||||||f |||| 00| 0 eng d
100 _aChang, Shyang-Jye
_9804254
100 _aHwang, Sheng-Jye
_9804255
245 0 _aDesign and Fabrication of An Ic Encapsulation Mold Adhesion Force Tester
300 _a281-285 p.
650 _aAdhesion Force
_9804256
650 _aEmc
_9794105
650 _aIc Packaging
_9804257
773 _d2003
_tIeee Transactions onElectronics Packaging Manufacturing
_x1523334X
942 _cART
_o51
_pABUL KALAM Library
999 _c758258
_d758258