000 | 00523nab a2200157Ia 4500 | ||
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100 |
_aChang, Shyang-Jye _9804254 |
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100 |
_aHwang, Sheng-Jye _9804255 |
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245 | 0 | _aDesign and Fabrication of An Ic Encapsulation Mold Adhesion Force Tester | |
300 | _a281-285 p. | ||
650 |
_aAdhesion Force _9804256 |
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650 |
_aEmc _9794105 |
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650 |
_aIc Packaging _9804257 |
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773 |
_d2003 _tIeee Transactions onElectronics Packaging Manufacturing _x1523334X |
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942 |
_cART _o51 _pABUL KALAM Library |
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999 |
_c758258 _d758258 |