| 000 | 00587nab a2200181Ia 4500 | ||
|---|---|---|---|
| 008 | 230808s2003 |||||||f |||| 00| 0 eng d | ||
| 100 |
_aKeezer, David C. _9804250 |
||
| 100 |
_aPatel, Chirag S. _9804251 |
||
| 100 |
_aBakir, Muhannad S. _9315006 |
||
| 100 |
_aZhou, Qing _9804252 |
||
| 245 | 0 | _aElectrical Test Strategies for A Wafer-Level Packaging Technology | |
| 300 | _a267-272 p. | ||
| 650 |
_aInterconnections _9768433 |
||
| 650 |
_aPackaging _994109 |
||
| 650 | _aTesting | ||
| 773 |
_d2003 _tIeee Transactions onElectronics Packaging Manufacturing _x1523334X |
||
| 942 |
_cART _o51 _pABUL KALAM Library |
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| 999 |
_c758256 _d758256 |
||