| 000 | 00552nab a2200157Ia 4500 | ||
|---|---|---|---|
| 008 | 230808s2004 |||||||f |||| 00| 0 eng d | ||
| 100 |
_aTatsuyuki, Saito _9803074 |
||
| 100 |
_aAshihara, Hiroshi _9277288 |
||
| 245 | 2 | _aA Reliability of Barrier-Metal-Clad Copper Interconnects with Self-Aligned Metallic Caps | |
| 300 | _a2129-2135 p. | ||
| 650 |
_aChemical Vapor Deposition (Cvd) _9688088 |
||
| 650 |
_aCopper Losses _9788523 |
||
| 650 |
_aElectromigration _9777428 |
||
| 773 |
_d2004 _tIeee Transactions on Electron Devices _x00189383 |
||
| 942 |
_cART _o51 _pABUL KALAM Library |
||
| 999 |
_c757546 _d757546 |
||