| 000 | 00520nab a2200145Ia 4500 | ||
|---|---|---|---|
| 008 | 230808s2004 |||||||f |||| 00| 0 eng d | ||
| 100 |
_aPei, Z J _9801227 |
||
| 245 | 3 | _aAn Experimental Investigation Into Soft-Pad Grinding of Wire-Sawn Silicon Wafers | |
| 300 | _a299-306 p. | ||
| 650 |
_aGrinding _952491 |
||
| 650 |
_aMachining Steel _9801228 |
||
| 650 |
_aMaterial Removal _9798985 |
||
| 773 |
_d2004 _tInternational Journal of Machine tools & Manufacture: Design, Research and Application _x08906955 |
||
| 942 |
_cART _o51 _pABUL KALAM Library |
||
| 999 |
_c756334 _d756334 |
||