| 000 | 00553nab a2200157Ia 4500 | ||
|---|---|---|---|
| 008 | 230808s1990 |||||||f |||| 00| 0 eng d | ||
| 100 |
_aMashiko, Youji _9789438 |
||
| 100 |
_aKohara, Masanobu _9789440 |
||
| 245 | 0 | _aMechanism of Electromigration in Ceramic Packages Induced by Chip-Coating Polyimide | |
| 300 | _a873-878 p. | ||
| 650 |
_aMechanism _982265 |
||
| 650 |
_aElectromigration _9777428 |
||
| 650 |
_aCeramic Packages _9788852 |
||
| 773 |
_d1990 _tIEEE Transactions on Components Hybrids and Manufacturing Technology _x01486411 |
||
| 942 |
_cART _o51 _pABUL KALAM Library |
||
| 999 |
_c749241 _d749241 |
||