| 000 | 00539nab a2200145Ia 4500 | ||
|---|---|---|---|
| 008 | 230808s1990 |||||||f |||| 00| 0 eng d | ||
| 100 |
_alin, A.W. _9788745 |
||
| 245 | 0 | _aEvaluation of Polyimides as Dielectric Materials for Multichip Packages with Multilevel Interconnection Structure | |
| 300 | _a207-213 p. | ||
| 650 |
_aEvaluation _918641 |
||
| 650 |
_aPolyimides _9713759 |
||
| 650 |
_aDielectric Materials _9107410 |
||
| 773 |
_d1990 _tIEEE Transactions on Components Hybrids and Manufacturing Technology _x01486411 |
||
| 942 |
_cART _o51 _pABUL KALAM Library |
||
| 999 |
_c749064 _d749064 |
||