| 000 | 00544nab a2200157Ia 4500 | ||
|---|---|---|---|
| 008 | 230808s1990 |||||||f |||| 00| 0 eng d | ||
| 100 |
_aLau, John H. _95010 |
||
| 100 |
_aHarkins, Girvin _9789148 |
||
| 245 | 0 | _aThermal Stress Analysis of Tape Automated Bonding Packages and Interconnections | |
| 300 | _a182-187 p. | ||
| 650 |
_aThermal Stress Analysis _9726435 |
||
| 650 |
_aAutomated Analysis _9701820 |
||
| 650 | _aBonding | ||
| 773 |
_d1990 _tIEEE Transactions on Components Hybrids and Manufacturing Technology _x01486411 |
||
| 942 |
_cART _o51 _pABUL KALAM Library |
||
| 999 |
_c749057 _d749057 |
||