| 000 | 00534nab a2200157Ia 4500 | ||
|---|---|---|---|
| 008 | 230808s1992 |||||||f |||| 00| 0 eng d | ||
| 100 |
_alin, A.W. _9788745 |
||
| 100 |
_aWong, Ching-Ping _9788746 |
||
| 245 | 0 | _aEncapsulant for Nonhermetic Multichip Packaging Applications | |
| 300 | _a510-518 p. | ||
| 650 |
_aEncapsulant _9769985 |
||
| 650 |
_aNonholonomic System _9788747 |
||
| 650 |
_aMultichip Package _9788748 |
||
| 773 |
_d1992 _tIEEE Transactions on Components Hybrids and Manufacturing Technology _x01486411 |
||
| 942 |
_cART _o51 _pABUL KALAM Library |
||
| 999 |
_c748839 _d748839 |
||