| 000 | 00562nab a2200157Ia 4500 | ||
|---|---|---|---|
| 008 | 230808s1997 |||||||f |||| 00| 0 eng d | ||
| 100 |
_aChen, Chun-Jen _9768421 |
||
| 100 |
_alin, Kwang Lung _9768422 |
||
| 245 | 0 | _aWetting Interactions BetweenNi-Cu-P Deposit and In-Sn Solders | |
| 300 | _a211-216 p. | ||
| 650 |
_aActivation Energy _9680774 |
||
| 650 |
_aWetting _958007 |
||
| 650 |
_aSolder Reliability _9780080 |
||
| 773 |
_d1997 _tIEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging _x10709894 |
||
| 942 |
_cART _o51 _pABUL KALAM Library |
||
| 999 |
_c746065 _d746065 |
||