| 000 | 00616nab a2200169Ia 4500 | ||
|---|---|---|---|
| 008 | 230808s1997 |||||||f |||| 00| 0 eng d | ||
| 100 |
_aCheng, Wood-Hi _9779812 |
||
| 100 |
_aWang, Szu-Chun _9779814 |
||
| 100 |
_aKuang, Jao-Hwa _9779816 |
||
| 245 | 0 | _aEffect of Au Thickness on Laser Beam Penetration in Semiconductor Laser Packages | |
| 300 | _a396-402 p. | ||
| 650 |
_aAu Catalyst _9757008 |
||
| 650 |
_aLaser Welding _9429831 |
||
| 650 |
_aOptoelectronic _9692740 |
||
| 773 |
_d1997 _tIEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging _x10709894 |
||
| 942 |
_cART _o51 _pABUL KALAM Library |
||
| 999 |
_c744939 _d744939 |
||