000 00581nab a2200169Ia 4500
008 230808s1998 |||||||f |||| 00| 0 eng d
100 _aWu, J H
_9764242
100 _aTay, A. A. O.
_9775140
100 _alim, T.B.
_9768086
245 2 _aA Three-Dimensional Modeling of Wire Sweep Incorporating Resin Cure
300 _a65-72 p.
650 _aResin
_9704315
650 _a3-D Model OfStitch
_9778990
650 _aWire Edm
_9751730
773 _d1998
_tIEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging
_x10709894
942 _cART
_o51
_pABUL KALAM Library
999 _c744575
_d744575