000 | 00581nab a2200169Ia 4500 | ||
---|---|---|---|
008 | 230808s1998 |||||||f |||| 00| 0 eng d | ||
100 |
_aWu, J H _9764242 |
||
100 |
_aTay, A. A. O. _9775140 |
||
100 |
_alim, T.B. _9768086 |
||
245 | 2 | _aA Three-Dimensional Modeling of Wire Sweep Incorporating Resin Cure | |
300 | _a65-72 p. | ||
650 |
_aResin _9704315 |
||
650 |
_a3-D Model OfStitch _9778990 |
||
650 |
_aWire Edm _9751730 |
||
773 |
_d1998 _tIEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging _x10709894 |
||
942 |
_cART _o51 _pABUL KALAM Library |
||
999 |
_c744575 _d744575 |