| 000 | 00673nab a2200169Ia 4500 | ||
|---|---|---|---|
| 008 | 230808s1998 |||||||f |||| 00| 0 eng d | ||
| 100 |
_aSaitoh, Takehisa _9726960 |
||
| 100 |
_aToya, M _9778675 |
||
| 100 |
_aMatsuyama, Y _9677163 |
||
| 245 | 0 | _aNumerical Stress Analysis of Resin Cracking in Lsi Plastic Packages Under Temperature Cyclic Loading Part lil Material Properties and Package Geometries | |
| 300 | _a407-412 p. | ||
| 650 |
_aDie Bond _9775169 |
||
| 650 |
_aEncapsulant _9769985 |
||
| 650 |
_aTemperature _9119334 |
||
| 773 |
_d1998 _tIEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging _x10709894 |
||
| 942 |
_cART _o51 _pABUL KALAM Library |
||
| 999 |
_c744438 _d744438 |
||