| 000 | 00634nab a2200169Ia 4500 | ||
|---|---|---|---|
| 008 | 230808s1997 |||||||f |||| 00| 0 eng d | ||
| 100 |
_aCho, Soon-Jin _9778462 |
||
| 100 |
_aPaik, Kyung-Wook _9768099 |
||
| 100 |
_aKim, Yong-Ju _9778463 |
||
| 245 | 4 | _aThe Effect OfOxidation of Cu-Base Leadframe onInterface Adhesion Between Cu Metal and Epoxy Molding Compound | |
| 300 | _a167-175 p. | ||
| 650 |
_aAdhesion _951632 |
||
| 650 |
_aCopper Oxide _9692635 |
||
| 650 |
_aLeadframes _9770024 |
||
| 773 |
_d1997 _tIEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging _x10709894 |
||
| 942 |
_cART _o51 _pABUL KALAM Library |
||
| 999 |
_c744355 _d744355 |
||