| 000 | 00619nab a2200169Ia 4500 | ||
|---|---|---|---|
| 008 | 230808s1997 |||||||f |||| 00| 0 eng d | ||
| 100 |
_aSo, Alex C. K. _9774423 |
||
| 100 | _aLai, J. K. L. | ||
| 100 |
_aChan, Yan C. _9774424 |
||
| 245 | 0 | _aAging Studies of Cu-Sn Intermetalilc Compounds in Annealed Surface Mount Solder Joints | |
| 300 | _a161-166 p. | ||
| 650 |
_aIntermetalilc _9721631 |
||
| 650 |
_aReliability _953955 |
||
| 650 |
_aSurface Mount Technology _996171 |
||
| 773 |
_d1997 _tIEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging _x10709894 |
||
| 942 |
_cART _o51 _pABUL KALAM Library |
||
| 999 |
_c744353 _d744353 |
||