| 000 | 00606nab a2200169Ia 4500 | ||
|---|---|---|---|
| 008 | 230808s1995 |||||||f |||| 00| 0 eng d | ||
| 100 |
_aBolchini, C _9772988 |
||
| 100 |
_aBuonanno, G. _9777381 |
||
| 100 |
_aBuonanno, Giacomo _9777382 |
||
| 245 | 2 | _aA Wafer Level Testability Approach Based on an Improved Scan Insertion Technique | |
| 300 | _a438-447 p. | ||
| 650 |
_aWafer _9712604 |
||
| 650 |
_aApproach _9716460 |
||
| 650 |
_aInsertion for ce _9777385 |
||
| 773 |
_d1995 _tIEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging _x10709894 |
||
| 942 |
_cART _o51 _pABUL KALAM Library |
||
| 999 |
_c743924 _d743924 |
||