000 | 00556nab a2200157Ia 4500 | ||
---|---|---|---|
008 | 230808s1995 |||||||f |||| 00| 0 eng d | ||
100 |
_aChen, Kua L. _9777017 |
||
100 |
_aZarudnij, Vladimir _9767221 |
||
245 | 2 | _aA Test Chip Design for Detecting Thin-Film Cracking in Integrated Circuits | |
300 | _a478-484 p. | ||
650 | _aTest | ||
650 |
_aIntegrated _9161853 |
||
650 |
_aChenilie Yarn _9777019 |
||
773 |
_d1995 _tIEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging _x10709894 |
||
942 |
_cART _o51 _pABUL KALAM Library |
||
999 |
_c743795 _d743795 |