| 000 | 00609nab a2200157Ia 4500 | ||
|---|---|---|---|
| 008 | 230808s1996 |||||||f |||| 00| 0 eng d | ||
| 100 |
_aYang, Yang _999809 |
||
| 100 |
_aBrews, J. R _9776879 |
||
| 245 | 0 | _aGuidelines for High-Performance Electronic Package Interconnections Approach for Strong Coupling | |
| 300 | _a372-381 p. | ||
| 650 |
_aGuidelines for Developing _9776880 |
||
| 650 |
_aElectronic Privacy _9776881 |
||
| 650 |
_aStrong Dimer _9776883 |
||
| 773 |
_d1996 _tIEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging _x10709894 |
||
| 942 |
_cART _o51 _pABUL KALAM Library |
||
| 999 |
_c743733 _d743733 |
||