| 000 | 00606nab a2200169Ia 4500 | ||
|---|---|---|---|
| 008 | 230808s1998 |||||||f |||| 00| 0 eng d | ||
| 100 |
_aSmyth, T. _9776386 |
||
| 100 |
_aTan, liang _9776387 |
||
| 100 |
_aChan, K. _9326868 |
||
| 245 | 2 | _aA Simulation Study of Long Throw Sputtering for Diffusion Barrier Deposition Into High Aspect Vias and Contacts | |
| 300 | _a1414-1425 p. | ||
| 650 |
_aIntegrated Circuit Metalilzation _9768476 |
||
| 650 |
_aSemiconductor Process Modeling _9776391 |
||
| 650 |
_aSimulation _92549 |
||
| 773 |
_d1998 _tIEEE Transactions on Electron Devices _x00189383 |
||
| 942 |
_cART _o51 _pABUL KALAM Library |
||
| 999 |
_c743547 _d743547 |
||