| 000 | 00609nab a2200157Ia 4500 | ||
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| 008 | 230808s2004 |||||||f |||| 00| 0 eng d | ||
| 100 |
_aSo, H. W. _9772174 |
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| 100 |
_aTaube, A. _9772175 |
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| 245 | 0 | _aNumerical Investigation OfInfluence of Material Properties and Adhesive Layer Thickness onHeating Efficiency of Microwave Curing of an Adhesive-Bonded Joint | |
| 300 | _a1414-1418 p. | ||
| 650 |
_aNumerical Investigation _9753016 |
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| 650 |
_aMaterial Parameters _9754065 |
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| 650 |
_aAdhesive Lyer Profile Effect _9775537 |
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| 773 |
_d2004 _tPolymer Engineering and Science _x00323888 |
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| 942 |
_cART _o51 _pABUL KALAM Library |
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_c743179 _d743179 |
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