| 000 | 00531nab a2200157Ia 4500 | ||
|---|---|---|---|
| 008 | 230808s1995 |||||||f |||| 00| 0 eng d | ||
| 100 |
_aBar-Cohen, Avram _9767536 |
||
| 100 |
_aSherwood, Greg _9775459 |
||
| 245 | 0 | _aGas-Assisted Evaporative Cooling of High Density Electronic Modules | |
| 300 | _a502-509 p. | ||
| 650 |
_aCooling _945329 |
||
| 650 |
_aEvaporation _979696 |
||
| 650 |
_aImmersion _9710362 |
||
| 773 |
_d1995 _tIEEE Transactions on Components Packaging and Manufacturing Technology Part A _x10709886 |
||
| 942 |
_cART _o51 _pABUL KALAM Library |
||
| 999 |
_c743144 _d743144 |
||