| 000 | 00554nab a2200133Ia 4500 | ||
|---|---|---|---|
| 008 | 230808s1995 |||||||f |||| 00| 0 eng d | ||
| 100 |
_aKubacki, Ronald M. _9775442 |
||
| 245 | 0 | _aLow Temperature Plasma Deposition of Silicon Nitride to Produce Ultra-Reliable High Performance Low Cost Sealed Chip-on-Boand (Scob) Assemblies | |
| 300 | _a471-477 p. | ||
| 650 |
_aTemperature Plasma _9775443 |
||
| 650 |
_aHigh Performance _9170051 |
||
| 773 |
_d1995 _tIEEE Transactions on Components Packaging and Manufacturing Technology Part A _x10709886 |
||
| 942 |
_cART _o51 _pABUL KALAM Library |
||
| 999 |
_c743136 _d743136 |
||