000 | 00508nab a2200145Ia 4500 | ||
---|---|---|---|
008 | 230808s1994 |||||||f |||| 00| 0 eng d | ||
100 |
_aChapman, G. H. _9774915 |
||
100 |
_aCarr, L. S. _9774916 |
||
245 | 0 | _aTest Vehicle for a Wafer-Scale Thermal Pixel Scens Simulator | |
300 | _a334-341 p. | ||
650 |
_aWafer _9712604 |
||
650 |
_aPixel Wise _9723487 |
||
773 |
_d1994 _tIEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging _x10709894 |
||
942 |
_cART _o51 _pABUL KALAM Library |
||
999 |
_c742890 _d742890 |