| 000 | 00608nab a2200169Ia 4500 | ||
|---|---|---|---|
| 008 | 230808s1996 |||||||f |||| 00| 0 eng d | ||
| 100 |
_aXie, D _9677292 |
||
| 100 |
_aChan, Yan C. _9774424 |
||
| 100 |
_aLai, J. K. L. _9774674 |
||
| 245 | 0 | _aFatigue life Studies on Defect-Free Solder Joints Fabricated from Modified Reflow Soldering | |
| 300 | _a679-684 p. | ||
| 650 | _aFatigue | ||
| 650 |
_aSolder-Joint Inspection _9768094 |
||
| 650 |
_aSoldering _952709 |
||
| 773 |
_d1996 _tIEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging _x10709894 |
||
| 942 |
_cART _o51 _pABUL KALAM Library |
||
| 999 |
_c742777 _d742777 |
||