| 000 | 00622nab a2200169Ia 4500 | ||
|---|---|---|---|
| 008 | 230808s2004 |||||||f |||| 00| 0 eng d | ||
| 100 |
_aLee, Tien-Yu _9774422 |
||
| 100 |
_aLee, Taek Jung _9728391 |
||
| 100 |
_aTu, King-Ning _9774425 |
||
| 245 | 2 | _aA Study of Electromigration in 3-D Flip Chip Solder Joint Using Numerical Simulation of Heat Flux and Current Density | |
| 300 | _a472-479 p. | ||
| 650 |
_aComputation Fluid Dynamics _9723704 |
||
| 650 |
_aCurrent Density _9686093 |
||
| 650 |
_aFlip-Chip _9765290 |
||
| 773 |
_d2004 _tIEEE Transactions on Components and Packaging Technologies _x15213331 |
||
| 942 |
_cART _o51 _pABUL KALAM Library |
||
| 999 |
_c742650 _d742650 |
||