| 000 | 00564nab a2200157Ia 4500 | ||
|---|---|---|---|
| 008 | 230808s2003 |||||||f |||| 00| 0 eng d | ||
| 100 |
_aVries, J. Hans De _9773697 |
||
| 100 |
_aJanssen, Esther _9773699 |
||
| 245 | 0 | _aHumidity and Reflow Resistance of Flip Chip on Foil Assemblies with Conductive Adhesive Joints | |
| 300 | _a563-568 p. | ||
| 650 |
_aConductive Adhesive _9773700 |
||
| 650 |
_aFlip Chi P _9773702 |
||
| 650 |
_aFlexible Structure _9768679 |
||
| 773 |
_d2003 _tIEEE Transactions on Components and Packaging Technologies _x15213331 |
||
| 942 |
_cART _o51 _pABUL KALAM Library |
||
| 999 |
_c742377 _d742377 |
||