| 000 | 00607nab a2200169Ia 4500 | ||
|---|---|---|---|
| 008 | 230808s1995 |||||||f |||| 00| 0 eng d | ||
| 100 |
_aAmagai, Masazumi _9773514 |
||
| 100 |
_aEbe, Kazuyoshi _9773515 |
||
| 100 |
_aSeno, Hideo _9773517 |
||
| 245 | 0 | _aCracking Failures in Lead-on Chip Packages Induced by Chip Backside Contamination | |
| 300 | _a119-126 p. | ||
| 650 |
_aWafer _9712604 |
||
| 650 |
_aAdhesive _9693759 |
||
| 650 |
_aPackage Modeling _9767703 |
||
| 773 |
_d1995 _tIEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging _x10709894 |
||
| 942 |
_cART _o51 _pABUL KALAM Library |
||
| 999 |
_c742315 _d742315 |
||