| 000 | 00594nab a2200157Ia 4500 | ||
|---|---|---|---|
| 008 | 230808s1995 |||||||f |||| 00| 0 eng d | ||
| 100 |
_aWojnarowski, J. _9773467 |
||
| 100 |
_aWildi, Eric J. _9773469 |
||
| 245 | 0 | _aDevelopment of a Plasitc Encapsulated Multichip Technology for High Volume, Low Cost Commercial Electronics | |
| 300 | _a59-65 p. | ||
| 650 |
_aNon linear _9702491 |
||
| 650 |
_aLow Cost _9696426 |
||
| 650 |
_aTechnology _947709 |
||
| 773 |
_d1995 _tIEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging _x10709894 |
||
| 942 |
_cART _o51 _pABUL KALAM Library |
||
| 999 |
_c742299 _d742299 |
||