000 | 00586nab a2200157Ia 4500 | ||
---|---|---|---|
008 | 230808s1995 |||||||f |||| 00| 0 eng d | ||
100 |
_aBanks, Donald R. _9773463 |
||
100 |
_aGerke, Burnette R. _9773464 |
||
100 |
_aMattay, Shyam _9773465 |
||
245 | 0 | _aReliability Comparison of Two Metaliurgies for Ceramic Bali Grid Array | |
300 | _a53-58 p. | ||
650 |
_aFailure Mechanism _9169524 |
||
650 |
_aRelibility Assessment _9773466 |
||
773 |
_d1995 _tIEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging _x10709894 |
||
942 |
_cART _o51 _pABUL KALAM Library |
||
999 |
_c742298 _d742298 |