| 000 | 00590nab a2200169Ia 4500 | ||
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| 008 | 230808s2004 |||||||f |||| 00| 0 eng d | ||
| 100 |
_aKwon, Woon-Seong _9771194 |
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| 100 |
_aJang, Se-Young _9771196 |
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| 100 |
_aPaik, Kyung-Wook _9768099 |
||
| 245 | 0 | _aExothermic Reaction Induced Eutectic Pb-Sn Solder Bali Melting InUnderfili Curing Process | |
| 300 | _a172-174 p. | ||
| 650 |
_aExotherm _9771198 |
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| 650 |
_aFlip Chip _9765290 |
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| 650 |
_aSolder Bali Reliability _9768068 |
||
| 773 |
_d2004 _tIEEE Transactions on Components and Packaging Technologies _x15213331 |
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| 942 |
_cART _o51 _pABUL KALAM Library |
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| 999 |
_c741400 _d741400 |
||