| 000 | 00541nab a2200157Ia 4500 | ||
|---|---|---|---|
| 008 | 230808s1999 |||||||f |||| 00| 0 eng d | ||
| 100 |
_aWong, C. P. _993201 |
||
| 100 |
_aWong, Michelie M. _9769984 |
||
| 245 | 0 | _aRecent Advances in Plastic Packaging of Flip Chip and Multichip Modules Mcm of Microelectronics | |
| 300 | _a21-26 p. | ||
| 650 |
_aEncapsulant _9769985 |
||
| 650 |
_aEpoxidation _9728683 |
||
| 650 |
_aFlip-Chip _9765290 |
||
| 773 |
_d1999 _tIEEE Transactions on Components and Packaging Technologies _x15213331 |
||
| 942 |
_cART _o51 _pABUL KALAM Library |
||
| 999 |
_c740906 _d740906 |
||