000 | 00578nab a2200157Ia 4500 | ||
---|---|---|---|
008 | 230808s2002 |||||||f |||| 00| 0 eng d | ||
100 |
_aZheng, Ming _9742679 |
||
100 |
_aWirtz, R. A _9767555 |
||
245 | 0 | _aCylindrical Pin-Fin Fan-Sink Heat Transfer and Pressure Drop Correlations | |
300 | _a15-22 p. | ||
650 |
_aCooling of Electronic Equipment _9769936 |
||
650 |
_a for ced Convection Heat Transfer _9769938 |
||
650 |
_aMeasurement and Data Processing _9753030 |
||
773 |
_d2002 _tIEEE Transactions on Components and Packaging Technologies _x15213331 |
||
942 |
_cART _o51 _pABUL KALAM Library |
||
999 |
_c740885 _d740885 |