| 000 | 00553nab a2200157Ia 4500 | ||
|---|---|---|---|
| 008 | 230808s2001 |||||||f |||| 00| 0 eng d | ||
| 100 |
_aChen, Chun-Jen _9768421 |
||
| 100 |
_alin, Kwang-Lung _9768422 |
||
| 245 | 0 | _aElectroless Ni Cu P Barrier Between Si/Ti/Al Pad and Sn-Pb Flip-Chip Solder Bumps | |
| 300 | _a691-697 p. | ||
| 650 |
_aDiffusion Barriers _9768423 |
||
| 650 |
_aElectroless Nickel Plating _9768424 |
||
| 650 |
_aFlip-Chip _9765290 |
||
| 773 |
_d2001 _tIEEE Transactions on Components and Packaging Technologies _x15213331 |
||
| 942 |
_cART _o51 _pABUL KALAM Library |
||
| 999 |
_c740335 _d740335 |
||