| 000 | 00610nab a2200169Ia 4500 | ||
|---|---|---|---|
| 008 | 230808s2001 |||||||f |||| 00| 0 eng d | ||
| 100 |
_aXiao, Guo-Wei _9768415 |
||
| 100 |
_aChan, Philip C. H. _9768417 |
||
| 100 |
_aCai, Jian _9168666 |
||
| 245 | 0 | _aEffect of Cu Stud Microstructure and Electroplating Process on Intermetalilc Compounds Growth and Reliability of Flip Chip Solder Bump | |
| 300 | _a682-690 p. | ||
| 650 |
_aCopper _9163065 |
||
| 650 | _aElectroplating | ||
| 650 |
_aFlip-Chip _9765290 |
||
| 773 |
_d2001 _tIEEE Transactions on Components and Packaging Technologies _x15213331 |
||
| 942 |
_cART _o51 _pABUL KALAM Library |
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| 999 |
_c740333 _d740333 |
||