| 000 | 00549nab a2200157Ia 4500 | ||
|---|---|---|---|
| 008 | 230808s2001 |||||||f |||| 00| 0 eng d | ||
| 100 |
_aFan, X-J. _9768085 |
||
| 100 |
_alim, T. B. _9768086 |
||
| 245 | 0 | _aInvestigation OfUnderfili Delamination and Cracking in Filp Chip Modules Under Temperature Cyclic Loading | |
| 300 | _a84-91 p. | ||
| 650 |
_aCracking _9169262 |
||
| 650 |
_aDelamination _9170371 |
||
| 650 | _aFinite - Element Analysis | ||
| 773 |
_d2001 _tIEEE Transactions on Components and Packaging Technologies _x15213331 |
||
| 942 |
_cART _o51 _pABUL KALAM Library |
||
| 999 |
_c740210 _d740210 |
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