| 000 | 00572nab a2200169Ia 4500 | ||
|---|---|---|---|
| 008 | 230808s2001 |||||||f |||| 00| 0 eng d | ||
| 100 |
_aZhang, Z _9753718 |
||
| 100 |
_aShi, S. H. _9768080 |
||
| 100 |
_aWong, C. P. _993201 |
||
| 245 | 0 | _aDevelopment of No-Flow Underfili Materials for Lead-Free Solder Bumped Flip-Chip Applications | |
| 300 | _a59-66 p. | ||
| 650 |
_aEpoxy Resin _9170487 |
||
| 650 |
_aFlip Chip _9765290 |
||
| 650 |
_aLead-Free Solder _9756437 |
||
| 773 |
_d2001 _tIEEE Transactions on Components and Packaging Technologies _x15213331 |
||
| 942 |
_cART _o51 _pABUL KALAM Library |
||
| 999 |
_c740207 _d740207 |
||