| 000 | 00674nam a2200229Ia 4500 | ||
|---|---|---|---|
| 008 | 020307s2000||||xx |||||||||||||| ||eng|| | ||
| 020 | _a0471168246 | ||
| 022 | _l0-471-16824-6 | ||
| 041 | _aeng | ||
| 082 |
_a671.732 _bSCH |
||
| 100 |
_aSchlesinger, Mordechay _eED _955660 |
||
| 245 | 0 | _aModern Electroplating | |
| 250 | _a4th | ||
| 260 |
_aNew York : _bJohn Wiley, _cc2000 |
||
| 300 | _aXIV, 868 p. | ||
| 440 | _aElectrochemical Society Series | ||
| 504 | _aNN | ||
| 650 | _aElectroplating | ||
| 700 |
_aPaunovic, Milan _eED _955661 |
||
| 856 |
_yTable of Contents _uhttps://eaklibrary.neduet.edu.pk:8443/catalog/bk/books/toc/0-471-16824-6.pdf |
||
| 942 |
_cBOO _o51 _pAbul Kalam Library |
||
| 999 |
_c376974 _d376974 |
||