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		ImprovimgElectrical Integrity of Cu-Cosi2 Contacted N+P Junction Diodes Using Nitrogen-Incorporated Ta Films As A Diffusion Barrier by Yang, Wei-Bin Source: Ieee Transactions on Electron Devices Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Dual Damascene Advanced Interconects; New Copper Seed Layer Enhamcement Process Metrology Using Ion Chromatography by Lee, J H Source: Microelectronics Journal Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Hydrogen Leakage Due to Stress Corrosion Cracking of Stator Conductors in 210 Mw Generator: A Case Study. by Sanyal, S. K Bhatka, U. C Jain, P Source: Ieee Transactions on Energy Conversion Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article

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