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Constitutive Relation and Creep-Fatigue life Model for Eutectic Tin-Lead Solder by
  • Fox, L.R
  • Knecht, Sheera
Source: IEEE Transactions on Components Hybrids and Manufacturing Technology
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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Creep Fatigue Modeling for Solder Joint Reliability Predictions IncludingMicrostructural Evolution OfSolder by
  • Frost, Harold J
  • Howard, Robert T
Source: IEEE Transactions on Components Hybrids and Manufacturing Technology
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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A Probabilisticmodel for Creep-Fatigue Failure. by
  • Harlow, D.G
  • Delph, T.J
Source: Transactions ofAsme, Journal of Pressure Vessel Technology
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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