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		Simulation of Temperature Cycling Effects on Electromigration Behavior Under Pulsed Current Stress by Haslett, J. W Gui, X Source: IEEE Transactions on Electron Devices Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Numerical Calculation of Electromigration Under Pulse Current with Joule Heating by li, Zhihong Wang, Yangyuan Sun, Ying Source: IEEE Transactions on Electron Devices Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		A Hierarchical Reliability Analysis for Circuit Design Evaluation by Riege, S. P Thompson, C. V Clement, J. J Source: IEEE Transactions on Electron Devices Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Planarized Multilevel Interconnection Using Chemical Mechanical Polishing of Selective Cvd-Ai Via Plugs by Amazawa, Takao Arita, Yoshinobu Yamamoto, EIIchi Source: IEEE Transactions on Electron Devices Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Mechanism of Electromigration in Ceramic Packages Induced by Chip-Coating Polyimide by Mashiko, Youji Kohara, Masanobu Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		A Reliability of Barrier-Metal-Clad Copper Interconnects with Self-Aligned Metallic Caps by Tatsuyuki, Saito Ashihara, Hiroshi Source: Ieee Transactions on Electron Devices Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Integration and Reliability of Cu-Sioc Interconnect for Arf/90-Nm Node Cmos Technology by Noguchi, Junji Oshima, Takayuki Source: Ieee Transactions on Electron Devices Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article

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