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		A Novel Type of Low Dielectric and Heat-Resistant Resin for Printed Wiring Boards by Nawa, Kazunari Ohkita, Masakazu Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Advanced Ceramic Substrates for Multichip Modules with Multilevel Thin Film Interconnects by Tormey, Elien S Bachner, Frank J Foster, Brian C Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Experimental Investigations of Machining Characteristics and Removal Mechanisms of Advanced Ceramics in High Speed Deep Grinding by Huang, B Source: International Journal of Machine tools & Manufacture: Design, Research and Application Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article

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