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An Assessment OfThermal Performance OfPbga Family by
  • Mulgaonker, Shailesh
  • Chambers, B
  • Mahalingam, Mali
Source: IEEE Transactions on Components Packaging and Manufacturing Technology Part A
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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The Role of Plastic Package Adhesion in Performance by
  • Kim, Samuel
Source: IEEE Transactions on Components Hybrids and Manufacturing Technology
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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Causes of Cracks in Smd and Type Specific Remedies by
  • Omi, Susumu
  • Fujita, Kazuya
  • Maeda, Takamichi
Source: IEEE Transactions on Components Hybrids and Manufacturing Technology
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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