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Reliability Comparison of Two Metaliurgies for Ceramic Bali Grid Array by
  • Banks, Donald R
  • Gerke, Burnette R
  • Mattay, Shyam
Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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Reliability Issues of Replacing Solder with Conductive Adhesives in Power Modules by
  • Rusanen, Outi
  • Lenkkeri, Jaako
Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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