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		Thermal Kcycling Aging Effects on Microstructural and Mechanical Properties of a Single Pbga Solder Joint Specimen by Pang, John H. L Tan, Kwang Hong Wang, Z Source: IEEE Transactions on Components and Packaging Technologies Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Fatigue life Studies on Defect-Free Solder Joints Fabricated from Modified Reflow Soldering by Xie, D Chan, Yan C Lai, J. K. L Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Development of an Inspection Process for Bali-Grid Array Technology Using Scanned-Beam X-Ray Laminography by Rooks, S. M Source: IEEE Transactions on Components Packaging and Manufacturing Technology Part A Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article

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