Your search returned 4 results.

Results
		Contributions from Thermal Chalienges in Next Generation Electronic Systems (Thermes) Source: IEEE Transactions on Components and Packaging Technologies Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		The History of Reliability Prediction by Denson, Wililam Source: IEEE Transactions on Reliability Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Some Practical Applications of Bayesian Reliability Measurements for Aerospace-Electronic Systems by Ghose, M. K Santhamma, K Source: Reliability Engineering : an International Journal Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		A Review of Thermal Enhancement Techniques for Electronic Systems by Fletcher, L. S Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article

Refine your search