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		Electronic Packaging Materials and their Properties by Pecht, Michael G [author] Agarwal, Rakesh [author] Mccluskey, Patrick [author] Series: Electronic Packaging Series Material type: Text Language: English Publication details: Boca Raton : CRC Press, c1999 Online access: Table of Contents Availability: Items available for loan: Circulation Section (1)Location, call number: Circulation Section 621.381046 PEC.
		Moisture Ingress Into Organic Laminates by Pecht, Michael G Ardebili, Haleh Shukla, Anand A Source: IEEE Transactions on Components and Packaging Technologies Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Thermal Assessmaent of Glass-Metal Composition Plasma Displauy Planels Using Design of Experiments by Lee, Mikyoung Pecht, Michael G Source: IEEE Transactions on Components and Packaging Technologies Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Junction Temperature Considerations in Evaluating Electronic Parts for Use Oputside Manufacturers Specified Temperature Ranges by Condra, lioyd Das, Diganta Pecht, Michael G Source: IEEE Transactions on Components and Packaging Technologies Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Pparameter Recharacterization a Method of Thermal Uprating by Das, Diganta Pecht, Michael G Source: IEEE Transactions on Components and Packaging Technologies Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Open for um by Pecht, Michael G Source: IEEE Transactions on Components and Packaging Technologies Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Lead-Free Soldering InJapanese Electronics Industry by Fukuda, Yuki Pecht, Michael G Fukuda, K Source: IEEE Transactions on Components and Packaging Technologies Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Environmental Aging and Deadhesion of Siloxane-Polyimide-Epoxy Adhesive by Murray, Steven Pecht, Michael G Source: IEEE Transactions on Components and Packaging Technologies Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Characterization of Hygroscopic Swelilng Behavior of Mold Compounds and Plastic Packages by Stelirecht, Eric Han, Bongtae Pecht, Michael G Source: IEEE Transactions on Components and Packaging Technologies Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		A Critique OfReliability Analysis Center Failure-Rate-Model for Plastic Encapsulated Microcircuits by Shukla, Anand A Pecht, Michael G Source: IEEE Transactions on Reliability Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Criteria for Assessment of Reliability Models by Pecht, Michael G Shukla, Anand A Kelkar, A. G Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Evaluation of Manufacturing Variables InReliability of Surface Mount Capacitors by Condra, lioyd Christou, Aris Johnson, Grant M Pecht, Michael G Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article

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