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Testability and Signal Integrity in a Low Cost Multichip Module by
  • Omer, Ahmed
  • Flint, andrew
Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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The Per-Unit-Length Capacitance Matrix of Flaring Vlsi Packaging Interconnections by
  • Omer, Ahmed
  • Cangeliaris, andreas C
  • Prince, John L
Source: IEEE Transactions on Components Hybrids and Manufacturing Technology
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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