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Novel Technique for Measuring Through-Plane Modulus in Thin Polymer Films by
  • Patel, Kaushal S
  • Kohl, Paul A
  • Bidstrup-Alien, Ann
Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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Sea of Leads (Sol) Ultrahigh Density Wafer-Level Chip Input/Output Interconnections for Gigascale Integration by
  • Bakir, Muhannad S
  • Reed, Hollie A
  • Kohl, Paul A
Source: Ieee Transactions on Electron Devices
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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