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		Test Vehicle for a Wafer-Scale Thermal Pixel Scens Simulator by Chapman, G. H Carr, L. S Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Test Vehicle for a Wafer-Scale Field Programmable Gate Array by Du for t, Benoit Chapman, G. H Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Effects of Scanning and Biasing Circuit Restructuring onResponse of a Large Area Magnetic Field Sensor Array by Audet, Y Chapman, G. H Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Yield Improvement of A Large Area Magnetic Field Sensor Array Using Redundancy Schemes. by Chapman, G. H Audet, Y Source: Ieee Transactions on Very Large Scale Intergration (Vlsi) Systems Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article

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